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PCB線路板設(shè)計(jì)中專業(yè)英譯術(shù)語之基材
來源:百能網(wǎng)
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作者:jiehao
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發(fā)布時間: 2625天前
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2261 次瀏覽
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PCB設(shè)計(jì)中專業(yè)英譯術(shù)語之基材：
1. 基材：base material
2. 層壓板：laminate
3. 覆金屬箔基材：metal-clad bade material
4. 覆銅箔層壓板：copper-clad laminate (CCL)
5. 單面覆銅箔層壓板：single-sided copper-clad laminate
6. 雙面覆銅箔層壓板：double-sided copper-clad laminate
7. 復(fù)合層壓板：composite laminate
8. 薄層壓板：thin laminate
1. 基材：base material
2. 層壓板：laminate
3. 覆金屬箔基材：metal-clad bade material
4. 覆銅箔層壓板：copper-clad laminate (CCL)
5. 單面覆銅箔層壓板：single-sided copper-clad laminate
6. 雙面覆銅箔層壓板：double-sided copper-clad laminate
7. 復(fù)合層壓板：composite laminate
8. 薄層壓板：thin laminate
PCB設(shè)計(jì)中專業(yè)英譯術(shù)語之基材：
1. 基材：base material
2. 層壓板：laminate
3. 覆金屬箔基材：metal-clad bade material
4. 覆銅箔層壓板：copper-clad laminate (CCL)
5. 單面覆銅箔層壓板：single-sided copper-clad laminate
6. 雙面覆銅箔層壓板：double-sided copper-clad laminate
7. 復(fù)合層壓板：composite laminate
8. 薄層壓板：thin laminate
9. 金屬芯覆銅箔層壓板：metal core copper-clad laminate
10. 金屬基覆銅層壓板：metal base copper-clad laminate
11. 撓性覆銅箔絕緣薄膜：flexible copper-clad dielectric film
12. 基體材料：basis material
13. 預(yù)浸材料：prepreg
14. 粘結(jié)片：bonding sheet
15. 預(yù)浸粘結(jié)片：preimpregnated bonding sheer
16. 環(huán)氧玻璃基板：epoxy glass substrate
17. 加成法用層壓板：laminate for additive process
18. 預(yù)制內(nèi)層覆箔板：mass lamination panel
19. 內(nèi)層芯板：core material
20. 催化板材：catalyzed board ,coated catalyzed laminate
21. 涂膠催化層壓板：adhesive-coated catalyzed laminate
22. 涂膠無催層壓板：adhesive-coated uncatalyzed laminate
23. 粘結(jié)層：bonding layer
24. 粘結(jié)膜：film adhesive
25. 涂膠粘劑絕緣薄膜：adhesive coated dielectric film
26. 無支撐膠粘劑膜：unsupported adhesive film
27. 覆蓋層：cover layer (cover lay)
28. 增強(qiáng)板材：stiffener material
29. 銅箔面：copper-clad surface
30. 去銅箔面：foil removal surface
31. 層壓板面：unclad laminate surface
32. 基膜面：base film surface
33. 膠粘劑面：adhesive faec
34. 原始光潔面：plate finish
35. 粗面：matt finish
36. 縱向：length wise direction
37. 模向：cross wise direction
38. 剪切板：cut to size panel
39. 酚醛紙質(zhì)覆銅箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
40. 環(huán)氧紙質(zhì)覆銅箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
41. 環(huán)氧玻璃布基覆銅箔板：epoxide woven glass fabric copper-clad laminates
42. 環(huán)氧玻璃布紙復(fù)合覆銅箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
43. 環(huán)氧玻璃布玻璃纖維復(fù)合覆銅箔板：epoxide non woven/woven glass reinforced copper-clad laminates
44. 聚酯玻璃布覆銅箔板：ployester woven glass fabric copper-clad laminates
45. 聚酰亞胺玻璃布覆銅箔板：polyimide woven glass fabric copper-clad laminates
46. 雙馬來酰亞胺三嗪環(huán)氧玻璃布覆銅箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47. 環(huán)氧合成纖維布覆銅箔板：epoxide synthetic fiber fabric copper-clad laminates
48. 聚四乙烯玻璃纖維覆銅箔板：teflon/fiber glass copper-clad laminates
49. 超薄型層壓板：ultra thin laminate
50. 陶瓷基覆銅箔板：ceramics base copper-clad laminates
51. 紫外線阻擋型覆銅箔板：UV blocking copper-clad laminates
1. 基材：base material
2. 層壓板：laminate
3. 覆金屬箔基材：metal-clad bade material
4. 覆銅箔層壓板：copper-clad laminate (CCL)
5. 單面覆銅箔層壓板：single-sided copper-clad laminate
6. 雙面覆銅箔層壓板：double-sided copper-clad laminate
7. 復(fù)合層壓板：composite laminate
8. 薄層壓板：thin laminate
9. 金屬芯覆銅箔層壓板：metal core copper-clad laminate
10. 金屬基覆銅層壓板：metal base copper-clad laminate
11. 撓性覆銅箔絕緣薄膜：flexible copper-clad dielectric film
12. 基體材料：basis material
13. 預(yù)浸材料：prepreg
14. 粘結(jié)片：bonding sheet
15. 預(yù)浸粘結(jié)片：preimpregnated bonding sheer
16. 環(huán)氧玻璃基板：epoxy glass substrate
17. 加成法用層壓板：laminate for additive process
18. 預(yù)制內(nèi)層覆箔板：mass lamination panel
19. 內(nèi)層芯板：core material
20. 催化板材：catalyzed board ,coated catalyzed laminate
21. 涂膠催化層壓板：adhesive-coated catalyzed laminate
22. 涂膠無催層壓板：adhesive-coated uncatalyzed laminate
23. 粘結(jié)層：bonding layer
24. 粘結(jié)膜：film adhesive
25. 涂膠粘劑絕緣薄膜：adhesive coated dielectric film
26. 無支撐膠粘劑膜：unsupported adhesive film
27. 覆蓋層：cover layer (cover lay)
28. 增強(qiáng)板材：stiffener material
29. 銅箔面：copper-clad surface
30. 去銅箔面：foil removal surface
31. 層壓板面：unclad laminate surface
32. 基膜面：base film surface
33. 膠粘劑面：adhesive faec
34. 原始光潔面：plate finish
35. 粗面：matt finish
36. 縱向：length wise direction
37. 模向：cross wise direction
38. 剪切板：cut to size panel
39. 酚醛紙質(zhì)覆銅箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
40. 環(huán)氧紙質(zhì)覆銅箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
41. 環(huán)氧玻璃布基覆銅箔板：epoxide woven glass fabric copper-clad laminates
42. 環(huán)氧玻璃布紙復(fù)合覆銅箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
43. 環(huán)氧玻璃布玻璃纖維復(fù)合覆銅箔板：epoxide non woven/woven glass reinforced copper-clad laminates
44. 聚酯玻璃布覆銅箔板：ployester woven glass fabric copper-clad laminates
45. 聚酰亞胺玻璃布覆銅箔板：polyimide woven glass fabric copper-clad laminates
46. 雙馬來酰亞胺三嗪環(huán)氧玻璃布覆銅箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47. 環(huán)氧合成纖維布覆銅箔板：epoxide synthetic fiber fabric copper-clad laminates
48. 聚四乙烯玻璃纖維覆銅箔板：teflon/fiber glass copper-clad laminates
49. 超薄型層壓板：ultra thin laminate
50. 陶瓷基覆銅箔板：ceramics base copper-clad laminates
51. 紫外線阻擋型覆銅箔板：UV blocking copper-clad laminates
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杰豪電路科技有限公司
全國服務(wù)熱線:?
138-0966-7475
電 話: 0752-6636055
傳 真: 0752-6636757
E-mail:jiehaopcb@163.com
總部地址：惠州市博羅縣園洲鎮(zhèn)陣村沙河大道27號
工廠地址：江西省贛州市定南縣富田工業(yè)區(qū)標(biāo)準(zhǔn)廠
房10/11/12棟
JIE HAO ELECTRONIC CIRCUIT CO., LTD
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